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| HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HL200101 Issued Date : 2000.01.15 Revised Date : 2001.12.06 Page No. : 1/3 H1N5817 thru H1N5819 1.0 AMP. SCHOTTKY BARRIER RECTIFIERS Features * Low Forward Voltage Drop * High Current Capability * High Reliability * High Surge Current Capability Maximum Ratings Ratings at 25C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load. For capacitive load, derate current by 20%. Type Number Maximum Recurrent Peak Reverse Voltage Maximum RMS Voltage Maximum DC Blocking Voltage Maximum Average Forward Rectified Current 0.375"(9.5mm) Lead Length @ TL=90C Peak Forward Surge Current, 8.3ms Single Half Sine-wave Superimposed on Rated Load (JEDEC method) Maximum Instantaneous Forward Voltage @ 1A Maximum Instantaneous Forward Voltage @ 3A Maximum DC Reverse Current At Rated DC Blocking Voltage Typical Thermal Resistance (Note 1) RJA Typical Junction Capacitance (Note 2) Operating Temperature Range Tj Storage Temperature Range TSTG 0.45 0.750 H1N5817 H1N5818 H1N5819 20 14 20 30 21 30 1 25 0.550 0.875 1 (@ Ta=25C) 10 (@ Ta=100C) 50 110 -65 to +125 -65 to +125 0.600 0.900 40 28 40 Units V V V A A V V mA mA C /W pF C C Note 1: Thermal resistance from junction to ambient vertical PC Board Mounting, 0.375"(9.5mm) lead length. Note 2: Measured at 1Mhz and applied reverse voltage of 4V D.C. H1N5817, H1N5818, H1N5819 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Characteristics Curve Fig.1 - Maximum Forward Current Derating Curve 1.00 1000 Spec. No. : HL200101 Issued Date : 2000.01.15 Revised Date : 2001.12.06 Page No. : 2/3 Fig.2 - Typical Junction Capactitance Average Forward Current (A) 0.75 0.50 Capacitance (pF) 0 25 50 75 100 o 100 0.25 0.00 125 150 175 10 0.1 1 10 100 Lead Temperature ( C) Reverse Voltage (V) Fig.3 - Typical Forward Characteristics 100 30 Fig.4 - Maximum Non-Repetitive Forward Surge Current Instantaneous Forward Current (A) . H1N5817 10 H1N5818,H1N5819 Peak Forward Surge Current (A) 25 20 8.3ms Single Half Sine Wave JIDIC Method 15 1 Tj=25oC Pulse Width=300us 1% Duty Cycle 0.1 0.1 0.3 0.5 0.7 0.9 1.1 1.3 1.5 1.7 1.9 2.1 10 5 0 1 10 100 Forward Soltage (V) Number Of Cycles At 60Hz H1N5817, H1N5818, H1N5819 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. DO-41 Dimension Spec. No. : HL200101 Issued Date : 2000.01.15 Revised Date : 2001.12.06 Page No. : 3/3 E A B C D DO-41 Molded Plastic Package HSMC Package Code: L *: Typical DIM A B C Inches Min. Max. 0.0280 0.0340 1.0000 0.1600 0.2050 Millimeters Min. Max. 0.71 0.86 25.40 4.10 5.20 DIM D E Inches Min. Max. 1.0000 0.0800 0.1070 Millimeters Min. Max. 25.40 2.00 2.70 Notes: 1.Dimension and tolerance based on our Spec. dated May 28,1998. 2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material: * Lead: 42 Alloy ; solder plating * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: * Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454 * Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 H1N5817, H1N5818, H1N5819 HSMC Product Specification |
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